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項目
Item
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代表特性
Typical Property
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試驗方法
Test method
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頁次
Page
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||
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合金成份
alloy
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Sn96.5Ag3.0Cu0.5
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-
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-
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||
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助焊劑含量
flux content
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11.5%(標準規格)
Standard
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-
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-
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||
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粒度.形狀
powder size. shape
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20~38μm?球形Sphere
TYPE 4
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IPC-TM-650
2.2.14.2
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2
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固相線溫度-液相線溫度
Melting point solidus-liquidus
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218℃-220℃
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-
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-
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氯含量
chlorine content
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0.03%
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調配值
BLEND VALUE
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-
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||
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擴展率
Rate of Spread
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235℃
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80.7%
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JIS-Z-3197-1999
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-
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銅板腐蝕試驗
Copper plate corrosion test
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合格
Pass
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JIS-Z-3284
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3
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鉻酸銀試紙試驗
Silver chromate test
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合格
Pass
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JIS-Z-3197-1999
IPC-TM-650 2.3.33
ISO9455-6
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|||
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銅鏡試驗
Copper mirror test
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合格
Pass
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JIS-Z-3197-1999
IPC-TM-650 2.3.32
ISO9455-5
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絕緣性試驗
Electric Insulation Resistance Test,SIR
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40℃,90%
168hr
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5.2×1012?
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JIS-Z-3284
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4
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85℃,85%
168hr
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1.2×109?
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||||
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電壓印加試驗
Voltage-applied Moisture Resistance,SIR (Bias DC45V)
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40℃,90%
168hr
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5.2×1012?
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IPC-TM-650
2.6.3.3.
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85℃,85%
168hr
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1.7×109?
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||||
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焊錫球試驗
Solder balling test
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良好
Good
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日本半田試驗法
NH METHOD
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5
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100g以上粘著力保持時間 Tackiness Time of keeping 100g minimum
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24hour
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JIS-Z-3284
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6
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預熱坍塌試驗
Slump test in heating
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0.2mm合格
0.2mmPass
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JIS-Z-3284
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|||
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流動性
Malcom螺旋式
Fluidity Characteristic Spiral
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粘度
Viscosity
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207Pa?s
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JIS-Z-3284
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7
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|
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Ti値
Thxo.Inde
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0.62
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連續印刷性
Printing Test
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良好
Good
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日本半田試驗法
NH METHOD
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8~9
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